Copper Plating Electrode (Ti GR.2 MASH + DSA COATING) Specification
Copper plating electrode (Ti GR.2 MASH + DSA COATING) Specification *** Ntau lawm: 12 nplooj1.Coating ib feem (ob tog) 2.Tam sim no ceev ASD: 2.5 ~ 3.5ADS3. Kev ua haujlwm tam sim no: 80% 4.DC voltage: DC15V5. Gap nrug (qhov deb ntawm plating ib feem thiab iridium electrode): 60 ~ 65mm6. Electrode lub neej ua haujlwm: 8 xyoo hauv kev siv 7. Plating tov tshuaj Cheebtsam (hom) thiab tshuaj kub: (dej, sulfuric acid, tooj liab sulfate, chlorine, optical fiber) 23 degree tswj
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Copper Plating Electrode yog dab tsi?
Copper electroplating yog txoj kev koom nrog electroplating ib txheej ntawm tooj liab mus rau txheej txheej ntawm cov khoom hlau. Cov txheej tooj liab tuaj yeem ua kom zoo nkauj, muab kev tiv thaiv corrosion, nce hluav taws xob thiab thermal conductivity, los yog txhim kho cov adhesion ntawm cov deposits ntxiv rau substrate. Copper yog siv los ua ib qho undercoat rau lwm yamhlauyog plated.
Copper plating electrode (Ti GR.2 MASH + DSA COATING) Specification
Ntau lawm ntau: 12 nplooj ntawv
1. Txheej txheej (ob tog)
2. Tam sim no ceev ASD: 2.5 ~ 3.5ADS
3. Kev ua haujlwm tam sim no: 80%
4. DC voltage: DC 15V
5. Kev ncua deb (qhov deb ntawm plating ib feem thiab iridium electrode): 60 ~ 65mm
6. Electrode lub neej ua haujlwm: 8 xyoo siv
7. Plating tov tshuaj Cheebtsam (hom) thiab tov kub: (dej, sulfuric acid, tooj liab sulfate, chlorine, optical fiber) 23 degree tswj
Tag nrho cov kev daws teeb meem thiab parameter:
Kev daws | Txheej hom | Lub neej ncua | Tam sim no ceev | Loj | |
Micro etching kua | Ir-Ta+ x | Tsawg dua los yog sib npaug rau 1.4 | 1-3 xyoo | 200-400A/m2 | kev cai ua |
Acid etching daws | Ir-Ta + x | Tsawg dua los yog sib npaug rau 1.4 | 1-3 xyoo | 100-300A/m2 | kev cai ua |
Alkaline etching kua | Ru-Ir + x | Tsawg dua lossis sib npaug rau 1.13 | 1-3 xyoo | 300-500A/m2 | kev cai ua |
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